Convection-Soldering

Consequently elaborated technology, modular design and excellent machining for constantly growing demands. Experiences put into practice have been made available for the user. Specially aligned for the reflow-soldering under air and nitrogen, as well as for the hardening of the SMD-glue. Safe and reliable soldering of the complete range of components. The medium of the forced convention secures stable and equal heat transmission.

Due to the unique circulation technique it is possible, with the aid of the forced convention, to achieve optimum soldering results. Every single heating zone itself can be thermally adjusted. By means of the special gas guidance the components are circulated and heated evenly.

The difference in temperature on the printed circuit board is reduced to the minimum. Beyond this, in the peak zone there are specific special solutions. Beginning from a heating length of 3300 mm the peak is converted into a double peak. This ensures the absolutely safe and reliable assembly of big and bulky components.


The air installation dissipates the polluted extracted-air via special blowers and supplies it to the internal extracted-air installation. In case of the nitrogen installation a steam trap is installed between peak and cooling section. The filter is easily exchangeable, which reduces the cleaning time of the process chamber.

The possibility of integrating an additional flux management between pre-heater and peak-zone is given, so that an even more effective filtering of the contaminated gas atmosphere can be achieved. The process obtains a higher stability, as there is nearly no pollution of the process chamber.